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Polyimide Label Materials

Coated polyimide for PCB and electronics manufacturing. Rated to 300 °C (572 °F).

The film, adhesive and coating are engineered as one system — for multi-pass reflow, ORH1 highly active fluxes and high-pressure chemical washes.

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Why polyimide

Extremely high heat tolerance

Glass transition above 250 °C and thermal decomposition above 500 °C — the headroom that lets it survive lead-free reflow where polyester and paper cannot.

Dimensional stability

A label that shrinks or curls takes its barcode with it — a distorted code fails verification even with the print intact. Our polyimide stays dimensionally stable through advanced reflow and wave solder.

Chemical resistance

The film resists solvents and cleaners — but the exposed surface is the topcoat. Our non-yellowing, non-softening coatings resist abrasion at temperature and withstand highly corrosive, highly active fluxes.

Naturally flame retardant

Polyimide is inherently flame retardant. Selected constructions carry UL94 VTM-0: XF-603, XF-731, XF-781.

Intrinsic dielectric strength

Polyimide is an electrical insulator — the reason it can sit on a populated board without creating a conductive path.

Stiffness and handling

Its stiffness supports small die-cut formats and automated application without distortion, and enables 1 mil constructions that stay stable where a softer film would not.

Long term100 hrs @ 150 °C (302 °F)
Operating5 min @ 260 °C (500 °F)
Short term90 sec @ 300 °C (572 °F)

ORH1 highly active flux resistance

ORH1 designates a highly active rosin flux: better wetting during soldering, and more aggressive chemical attack on everything else — including the label topcoat. We name the class and identify exactly which materials are validated against it.

FilmORH1 flux resistant
1 mil polyimideXF-603 · XF-731 · XF-781
2 mil polyimideXF-732 · XF-782

ESD-safe constructions

For static-sensitive assemblies, static-dissipative through the whole stack — topcoat, adhesive and release liner — protecting against charge from human contact (HBM) and charged devices (CDM). The < 125 V low-charging spec holds on liner removal and again when the label is removed and repositioned.

Surface resistance≥10⁹ and ≤10¹¹ ohms
Low charging — PSA & liner< 125 V
Static decay0.02 sec to 1% (EIA 541, XF-101ME)
ESD surface durability>500 IPA double rubs (ASTM D4752-10)
ANSI/ESD S20.20ESD S541IEC 61340JEDEC JESD 625B

ESD materials: XF-781 · XF-784 · XF-782 · XF-446 · Apex XF-101ME · XF-101SE · XF-102SE

Apex Series

Apex shares the polyimide film and thermal envelope of the established range; the coating and adhesive system is reformulated for where PCB processes have moved — more aggressive cleaning, more active fluxes and smaller barcodes. For a new qualification on an aggressive line, start with Apex; where a material is already qualified, there is no reason to requalify.

SKUFinishThickness
XF-101M / XF-102MMatte white1 mil / 2 mil
XF-101S / XF-102SSemi-gloss white1 mil / 2 mil
XF-101G / XF-102GHigh gloss white1 mil / 2 mil
XF-101MEMatte white, ESD-safe1 mil
XF-101SE / XF-102SESemi-gloss white, ESD-safe1 mil / 2 mil

Full Apex Series page →

PCB label product line

All polyimide materials rated 100 hrs @ 150 °C · 5 min @ 260 °C · 90 sec @ 300 °C unless noted.

1 mil (25 µm) polyimide

ProductFinishAdhesiveORH1ESDUL94 VTM-0REACH/RoHSUL 969
XF-504Semi-gloss blue1 mil acrylic
XF-505Semi-gloss green1 mil acrylic
XF-518Matte white1 mil acrylic
XF-528High gloss white1 mil acrylic
XF-581Semi-gloss white1 mil acrylic
XF-583Matte white1 mil acrylic
XF-603Semi-gloss white1.1 mil acrylic
XF-731Semi-gloss white1 mil acrylic
XF-781Semi-gloss white1 mil acrylic

2 mil (50 µm) polyimide

ProductFinishAdhesiveORH1ESDUL94 VTM-0REACH/RoHSUL 969
XF-519Matte white1.5 mil acrylic
XF-520Semi-gloss yellow2 mil acrylic
XF-525Semi-gloss green2 mil acrylic
XF-529High gloss white1.5 mil acrylic
XF-541Matte buff2 mil acrylic
XF-552High gloss yellow2.4 mil acrylic
XF-555High gloss white2 mil acrylic
XF-582Semi-gloss white2 mil acrylic
XF-584Matte white2 mil acrylic
XF-592Semi-gloss white2.4 mil acrylic
XF-732Semi-gloss white2 mil acrylic
XF-782Semi-gloss white2 mil acrylic

Polyester (post-process, lower temperature)

ProductFilmFinishAdhesiveESDTemperatureREACH/RoHSUL 969
XF-6111.5 mil polyesterSemi-gloss white1.1 mil acrylic−40 to 150 °C
XF-4462 mil polyesterGloss white1 mil acrylic100 hrs @ 150 °C; −40 to 204 °C

Specifications transcribed from product literature; ESD = static-dissipative and low-charging. Verify against the current technical data sheet before production.

Applications

PCB & electronics

PCB identification · WIP labeling · component tracking · IC permanent ID

Asset & warranty

Asset tracking · warranty labeling · ESD-safe packaging · stacked-product labels

Industries

Aerospace · Automotive · Electronics · Laboratory

FAQ

What temperature can polyimide labels withstand?

Typically 100 hours at 150 °C, 5 minutes at 260 °C and 90 seconds at 300 °C — covering standard and lead-free reflow as well as wave solder exposure.

If the film is a commodity, what makes one label different?

The film rarely fails. The topcoat carrying the printed image and the adhesive at the bond line decide whether a label survives — both are formulated and coated, and that is where the engineering sits.

What is ORH1 flux and why does it matter?

ORH1 designates a highly active rosin flux — better wetting during soldering, and more aggressive attack on everything else it contacts, including the topcoat. Validated: XF-603, XF-731, XF-781, XF-732, XF-782.

Qualify it on your own line

Tell us your process conditions, printer and ribbon — we will match a material and send samples.