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Apex™ Series

Next-Generation Polyimide Labels for Advanced PCB Manufacturing

20+ YearsSpecialty Material Expertise
Multi-Brand PortfolioGlobal Brands + ETIA Materials
Asia-Based SupplyLocal Stock & Application Support
Overview

Overview

The Apex™ Series is engineered for next-generation PCB manufacturing. Advanced coating technology delivers exceptional resistance to high-temperature reflow, aggressive cleaning chemicals, and demanding production environments while maintaining superior print quality, durable adhesion, and reliable traceability.

Features

Features

Benefits

Benefits

Specifications

Specifications

ModelFilmFinishTotal thicknessAdhesion (24h, SS)ESD
XF-101M →1 mil (25µm) PIMatte white2.4 mil (61 µm)≥ 40 oz/in—
XF-101S →1 mil (25µm) PISemi-gloss white2.4 mil (61 µm)≥ 40 oz/in—
XF-101G →1 mil (25µm) PIHigh-gloss white2.4 mil (61 µm)≥ 40 oz/in—
XF-101ME →1 mil (25µm) PIMatte white2.4 mil (61 µm)≥ 40 oz/inStatic-dissipative
XF-101SE →1 mil (25µm) PISemi-gloss white2.4 mil (61 µm)≥ 40 oz/inStatic-dissipative
XF-102M →2 mil (50µm) PIMatte white3.9 mil (99 µm)≥ 50 oz/in—
XF-102S →2 mil (50µm) PISemi-gloss white3.9 mil (99 µm)≥ 50 oz/in—
XF-102G →2 mil (50µm) PIHigh-gloss white3.9 mil (99 µm)≥ 50 oz/in—
XF-102SE →2 mil (50µm) PISemi-gloss white3.9 mil (99 µm)≥ 50 oz/inStatic-dissipative

Next-Generation Polyimide Labels for Advanced PCB Manufacturing — Sample list

No online download — samples and the TDS are sent one-to-one by email.

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